1 Introduction Hard and brittle materials refer to materials with high hardness and high brittleness, usually non-conductors or semiconductors, such as various kinds of stone, glass, silicon crystals, quartz crystals, hard alloys, and ceramics. With the development of science and technology and modern industry, the application fields of hard and brittle materials are expanding, and the processing technology of hard and brittle materials is also constantly developing. In various hard and brittle materials processing methods, cutting processing plays an important role. For example, in the processing of building decorative plates and precision parts of rock materials, sawing is the first process of machining, and the cost of sawing accounts for more than 50% of the total processing cost. Currently, various diamond cutting tools are used for cutting and processing hard and brittle materials such as stone. As diamond is the hardest material known in nature, its excellent properties determine its broad prospects for development in the field of cutting and processing of hard and brittle materials such as stone. The processing methods for sawing hard and brittle materials by using diamond tools mainly include: circular saw blade cutting, diamond band saw cutting, diamond frame saw cutting, and diamond bead saw cutting. Although each method has its own different characteristics and application range, its cutting mechanism and diamond wear mechanism are roughly the same. As rock cutting is the most important use of diamond cutting tools, it is of great significance to deeply study the mechanism of stone sawing and the wear mechanism of diamond cutting tools for the rational manufacture and correct use of diamond cutting tools. For a long time, experts and scholars at home and abroad have conducted extensive experiments and research on the processing mechanism of diamond tool sawing granite, the wear mechanism of diamond tools, and the sawing power in the sawing process, and have achieved remarkable results. The research and development of processing and diamond tools have played an active theoretical guiding role. 2 Research on diamond cutting stone sawing mechanism Diamond abrasives are usually made by cutting or sintering. The cutting process of diamond tools is similar to that of grinding. However, due to the influence of materials, the processing mechanism of hard and brittle materials such as rocks and ceramics is different from the metal processing mechanism, and the processing process is more complicated. Since the diamond cutting tool was first applied to stone cutting, there are many researches on the mechanism of diamond cutting stone. Domestic and foreign scholars have conducted long-term research on the processing mechanism of diamond tools sawing granites. From the early application of rock fracture theory under the intrusion of the indenter, single-grain diamond scratch surface morphology observation method has gradually developed to comprehensive application of polarizing microscope and scanning electron microscope. Observe the morphology of rock processing surface and the generation and propagation of cracks, and use acoustic emission signals to evaluate the cutting status of rocks. However, due to the complex cutting and cutting processes of hard and brittle materials such as rocks, the study of its cutting mechanism has not yet formed a unified understanding. Similar to the grinding process, people first studied the mechanism of action between single diamond particles and stone during cutting. Early experimental studies have shown that: When single-grained diamonds cut granites under different conditions, the main failure modes of the rock are brittle collapse; at the same time, according to different mineral compositions, there are still plastic deformations in the rock.
Fig.1 P.Bienert model of single-grained diamond cutting rock
Fig. 2 Improved single particle diamond cutting rock model by M.Meding
1. Friction between the substrate and the chip 2. The substrate is chipped by the chips and flakes 3. The first chip area 4. The friction between the stone and the abrasive grain 5. The plastic deformation 6. The elastic deformation Figure 3 The mechanical action between the tool and the workpiece when cutting the stone
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